Combined effects of sub-cooling and operating pressure on the performance of a two-chamber thermo syphon

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 61-69

  Ramaswamy, Chandrashekhar ^a   Joshi, Yogendra K ^a   Nakayama, Wataru ^a   Johnson, William B ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Boiling; Enhanced structure; Sub cooled; Thermosyphon; Two phase

Indexed keywords

ATMOSPHERIC PRESSURE; BOILING LIQUIDS; COOLING; EVAPORATORS; HEAT FLUX; HEAT LOSSES; HEAT TRANSFER; SATURATION (MATERIALS COMPOSITION);

CRITICAL HEAT FLUX (CHF); TWO-CHAMBER THERMOSYPHONS;

MICROPROCESSOR CHIPS;

EID: 0033907396     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.833043     Document Type: Article

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