A review of SMD-PCB defects and detection algorithms

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8350, Issue , 2012, Pages

  Mohd Hani, Ahmad Fadzil ^a   Malik, Aamir Saeed ^a   Kamil, Raja ^b   Thong, Chung Mun ^c  

^a DEPARTMENT OF CHEMICAL ENGINEERING   (Malaysia)

^b UNIVERSITY PUTRA MALAYSIA   (Malaysia)

^c AOI Group   (Malaysia)

Author keywords

AOI; classifier; defects; feature extraction; segmentation; SMD PCB

Indexed keywords

AOI; AUTOMATIC OPTICAL INSPECTION; CLASSIFICATION ACCURACY; CLASSIFICATION OF DEFECTS; CLASSIFICATION PERFORMANCE; DETECTION ALGORITHM; ELECTRONIC MANUFACTURING; FEATURE EXTRACTION ALGORITHMS; MANUFACTURED PRODUCTS; PATTERN RECOGNITION ALGORITHMS; SEGMENTATION ALGORITHMS; SMD-PCB; SOLDER-JOINT DEFECTS; SURFACE MOUNT DEVICE;

ALGORITHMS; CLASSIFIERS; COMPUTER VISION; FEATURE EXTRACTION; IMAGE ANALYSIS; IMAGE SEGMENTATION; OPTICAL TESTING; ORGANIC POLLUTANTS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS;

DEFECTS;

EID: 84857293372     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.920531     Document Type: Conference Paper

References (32)

1. Crispin, A. J. and Rankov, V., " Automated inspection of PCB components using a genetic algorithm templatematching approach," Int. J. Adv. Manuf. Technol. 35, 293-300 (2007).
2. IPC Task Group 7-31b, [IPC-A-610D Acceptability of Electronics Assemblies], Institute of Printed Circuit, Illinois, (2005).
3. Chang, P. C., Chen, L. Y. and Fan, C. Y., "A case-based evolutionary model for defect classification of printed circuit board images," J. Intell. Manuf. 19(2), 203-214, (2008).
4. Chen, C. J., Lai, S. H., Lee, W. H., Lin, C. Y., Ku, T., Chen, C. H. and Chung, Y. C., "Hausdorff distance based PCB inspection system with defect classification," Proc. of SPIE, Conf. on Two- and Three- Dimensional Methods for Inspection and Metrology III, 6000 600008, 1-12 (2005).
5. Ibrahim, Z. and Al-Attas, S. A. R. "Wavelet-based printed circuit board inspection system," Int. J. Sig. Proc. 1(2), 73-79 (2005).
6. Sankaran, V., Chartrand, B., Millard, D. L., Embrechts, M. J. and Kraft, R. P., "Automated inspection of solder joints - a neural network approach," IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium, 232-237 (1995).
7. Ko, K. W., Cho, H. S., Kim, J. H. and Kim, J. S., "Solder joints inspection using neural network and fuzzy rule-based classification," Proc. 1998 IEEE/RSJ Int'l Conf. on Intell. Robots and Sys., 1565-1570 (1998).
8. Kim, T. H., Cho, T. H., Moon, Y. S. and Park, S. H., "Visual inspection system for the classification of solder joints," Pattern Recognition 32(4), 565-575 (1999).
9. Ko, K. W. and Cho, H. S., "Solder joints inspection using a neural network and fuzzy rule-based classification method," IEEE Tran. Elect. Pack. Manuf. 23(2), 93-103 (2000).
10. Acciani, G., Brunetti, G. and Fornarelli, G., "Application of neural networks in optical inspection and classification of solder joints in surface mount technology," IEEE Trans. Indus. Info. 2(3), 200-209 (2006).
11. Giaquinto, A., Fornarelli, G., Brunetti, G. and Acciani, G., "A neurofuzzy method for the evaluation of soldering global quality index," IEEE Trans. Indus. Info. 5(1), 56-66 (2009).
12. Teoh, E. K., Mittal, D. P., Lee, B. W. and Wee, L. K., "Automated visual inspection of surface mount PCBs,"Proc. 16th Annual Conf. of IEEE Indus. Elec. Soc. IECON'90, 576-580 (2002).
13. Wu, C. H., Wang, D. Z., Ip, A., Wang, D. W., Chan, C. Y. and Wang, H. F., "A particle swarm optimization approach for components placement inspection on printed circuit boards," J. Intell. Manuf. 20(5), 535-549 (2009).
14. Gallegos, J. M., Villalobos, J. R., Carrillo, G. and Cabrera, S. D., "Reduced-dimension and wavelet processing of SMD images for real-time inspection," Proc. IEEE Southwest Symp. Image Analysis and Interpretation, 30-36 (1996).
15. Lin, S. C. and Su, C. H., "A visual inspection system for surface mounted devices on printed circuit board," Proc. IEEE Conf. Cyber. and Intell. Sys. 1-4 (2006).
16. Bishop, C. M., [Neural Networks for Pattern Recognition] Oxford University Press, (1995).
17. Fu, K. S., "Pattern recognition for automatic visual inspection," Computer 15(2), 34-40 (1992).
18. Moganti, M. and Ercal, F., "Automatic PCB inspection systems," IEEE Potentials 14(3), 6-10 (1995).
19. Moganti, M., Ercal, F., Dagli, C. H. and Tsunekawa, S., "Automatic PCB inspection algorithms: a survey,"Computer Vision and Image Understanding 63(2), 287-313 (1996).
20. Kim, N. H., Pyun, J. Y., Choi, K. S., Choi, B. D. and Ko, S. J., "Real-time inspection system for printed circuit boards," Proc. ISIE 2001 IEEE Int'l Sym. in Indus. Elec. 166-170 (2001).
21. Mahon, J., Harris, N. and Vernon, D., "Automated visual inspection of solder paste deposition on surface mount technology PCBs," Computer in Industry 12(1), 31-42 (1998).
22. Gonzalez, R. C. and Woods. R. E., [Digital Image Processing], Prentice Hall, (2002).
23. Acciani, G., Brunetti, G. and Fornarelli, G., "Automatic detection of solder joint defects on integrated circuits,"Proc. IEEE Int'l Symp. Circuits and Systems ISCAS, 1021-1024 (2007).
24. Zervakis, M. E., Goumas, S. K. and Rovithakis, G. A., "A bayesian framework for multilead SMD post-placement quality inspection," IEEE Trans. Syst. Man, and Cyber - Part B 34(1), 440-453 (2004).
25. Fanni, A., Lera, M., Marongiu, E. and Montisci, A., "Neural network diagnosis for visual inspection in printed circuit boards," Proc. DX00 11th Int'l Workshop on Principles of Diagnosis (2000).
26. Mar, N. S. S., Yarlagadda, P. K. D. V. and Fookes, C., "Design and development of automatic visual inspection system for PCB manufacturing," Robotics and Computer-Integrated Manufacturing 27(5), 949-962 (2011).
27. Theodoridis, S. and Koutroumbas, K., [Pattern Recognition], Academic Press, (2009).
28. th IEEE industry applications society annual meeting, 680-684 (2005).
29. Taniguchi, T., Kacprzak, D., Yamada, S. and Iwahara, M., "Wavelet-based processing of ECT images for inspection of printed circuit board," IEEE Trans. Magnetics 37(4), 2790-2793 (2001).
30. Howart, M. and Lotfi, A., "Adaptive fuzzy control of solder paste printing: the identification of deposit defects,"Proc. 24th IEEE/CPMT Elec. Manuf. Tech. Symp, 102-107 (1999).
31. Jagannathan, S., "Automatic inspection of wave soldered joints using neural network," J. Manuf. Sys. 16(6), 389-398 (1997).
32. Yun, T. S., Sim, K. J. and Kim, H. J., "Support vector machine-based inspection of solder joints using circular illumination," Electronics Letters 36(11), 949-951 (2000).