Advanced surface protection for improved reliability PCB systems (ASPIS)

Circuit World

Volumn 38, Issue 1, 2012, Pages 21-29

  Ballantyne, Andy ^a   Forrest, Greg ^a   Goosey, Martin ^b   Griguceviciene, Asta ^c   Juodkazyte, Jurga ^c   Kellner, Rod ^d   Kosenko, Aleksandr ^a   Ramanauskas, Rimantas ^a   Ryder, Karl ^a   Selskis, Algirdas ^c   Tarozaite, Rima ^c   Veninga, Erik ^e  

^a UNIVERSITY OF LEICESTER   (United Kingdom)

^b Institute of Circuit Technology Ltd   (United Kingdom)

^c CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY   (Lithuania)

^d Env Aqua Solutions Ltd   (United Kingdom)

^e TNO   (Netherlands)

Author keywords

ASPIS; Black pad; Electroless nickel; ENIG; Immersion gold; Ionic liquids; Solderability; Solderable finish; Soldering; Substrates; Surface treatment

Indexed keywords

ASPIS; BLACK PAD; ELECTROLESS NICKEL; ENIG; SOLDERABILITY; SOLDERABLE FINISH;

GOLD; IONIC LIQUIDS; POLYCHLORINATED BIPHENYLS; RELIABILITY ANALYSIS; SOLDERING; SUBSTRATES; SURFACE TREATMENT;

GOLD DEPOSITS;

EID: 84856885981     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056121211195021     Document Type: Article

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