Effect of substrate modulus on the fatigue behavior of adhesively bonded joints

Materials Science and Engineering: A

Volumn 534, Issue , 2012, Pages 594-602

  Azari, S ^a   Ameli, A ^a   Datla, N V ^a   Papini, M ^a,b   Spelt, J K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

^b RYERSON UNIVERSITY   (Canada)

Author keywords

Adhesive joint; Fatigue; Finite element method; Residual stresses; Toughened epoxy

Indexed keywords

ADHESIVE JOINTS; CRACK TIPS; CURING; ENERGY RELEASE RATE; RESIDUAL STRESSES; STIFFNESS;

% REDUCTIONS; ADHERENDS; ADHESIVE SYSTEMS; ADHESIVELY BONDED JOINTS; ENERGY-RELEASE RATES; EPOXY ADHESIVES; FATIGUE BEHAVIOUR; SUBSTRATE MATERIAL; SUBSTRATE STIFFNESS; TOUGHENED EPOXIES;

FINITE ELEMENT METHOD;

EID: 84856520010     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.12.014     Document Type: Article

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