Crack growth analysis at adhesive-adherent interface in bonded joints under mixed mode I/II

Engineering Fracture Mechanics

Volumn 75, Issue 18, 2008, Pages 5122-5133

  Marannano, G V ^a   Mistretta, L ^a   Cirello, A ^a   Pasta, S ^a  

^a UNIVERSITY OF PALERMO   (Italy)

Author keywords

Adhesive joint; Crack growth; Interface crack; MMELS specimen; Virtual crack closure technique

Indexed keywords

ADHESIVE JOINTS; ALUMINA; BENDING TESTS; CRACK CLOSURE; CRACK PROPAGATION; CRACKING (CHEMICAL); ENERGY RELEASE RATE; EPOXY RESINS; FATIGUE CRACK PROPAGATION; FINITE ELEMENT METHOD; JOINTS (STRUCTURAL COMPONENTS); STRAIN RATE;

A-PLANE; ADHERENT INTERFACES; ADHESIVE LAYERS; ANALYTICAL EXPRESSIONS; APPLIED LOADS; BEAM THEORIES; BONDED JOINTS; COMPUTING; CRACK GROWTH; CRACK GROWTH ANALYSIS; CRACK GROWTH BEHAVIORS; CRACK LENGTHS; ENERGY RELEASES; EPOXY ADHESIVES; FATIGUE CRACK GROWTHS; FE SOLUTIONS; FINITE ELEMENTS; INTERFACE CRACK; INTERFACE CRACKS; MIXED MODES; MMELS SPECIMEN; RAPID PROPAGATIONS; STABLE CRACK GROWTHS; STRAIN ENERGY RELEASE RATES; THIN LAYERS; VIRTUAL CRACK CLOSURE TECHNIQUE; VIRTUAL CRACK CLOSURE TECHNIQUES;

CRACKS;

EID: 54949094660     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2008.07.010     Document Type: Article

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