Effect of residual stress on the energy release rate of wedge and DCB test specimens

International Journal of Adhesion and Adhesives

Volumn 26, Issue 4, 2006, Pages 285-294

  Guo, Shu ^a,c   Dillard, David A ^a   Nairn, John A ^b  

^a Virginia Polytechnic Institute and State University   (United States)

^b University of Utah ^*  (United States)

^c NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Fracture; Fracture analysis; Interfaces

Indexed keywords

ADHESIVES; ENERGY RESOURCES; FRACTURE; PIEZOELECTRICITY; TENSILE STRESS; THERMOANALYSIS;

FRACTURE ANALYSIS; INTERFACES; LINEAR ELASTIC FRACTURE MECHANICS; SIMPLE BEAM THEORY;

STRESS ANALYSIS;

ADHESIVES; ENERGY; FRACTURE; PIEZOELECTRICITY; STRESS ANALYSIS; TENSILE STRESS;

EID: 30544454920     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2005.04.002     Document Type: Article

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