Direct transfer patterning of gold films with minimal processing steps

Thin Solid Films

Volumn 520, Issue 7, 2012, Pages 2600-2604

  Fakhr, Omar ^a,b   Karrai, Khaled ^a   Lugli, Paolo ^b  

^a ATTOCUBE SYSTEMS AG   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

Electrodes; Gold; Nano patterning; Poly(dimethylsilozane); Soft lithography

Indexed keywords

3D STRUCTURE; ADHESION PROBLEM; CHAIN MOLECULES; DIRECT TRANSFER; EVAPORATION RATE; GOLD FILM; MINIMAL PROCESSING; NANOPATTERNING; PDMS SURFACES; POLY(DIMETHYLSILOZANE); PROCESSING STEPS; ROOT MEAN SQUARE; SOFT LITHOGRAPHY; THIN GOLD FILM; TRANSFER PRINTING;

ADHESION; ELECTRODES; EVAPORATION; METALLIC FILMS; MICROCHANNELS; OLIGOMERS; PHASE TRANSITIONS;

GOLD;

EID: 84856405406     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.11.006     Document Type: Article

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