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1
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0032648988
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A thermoelectric converter for energy supply
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Apr.
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H. Glosch, M. Ashauer, U. Pfeiffer, and W. Lang, "A thermoelectric converter for energy supply," Sens. Actuators A, Phys., vol. 74, no. 1-3, pp. 246-250, Apr. 1999.
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(1999)
Sens. Actuators A, Phys.
, vol.74
, Issue.1-3
, pp. 246-250
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Glosch, H.1
Ashauer, M.2
Pfeiffer, U.3
Lang, W.4
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2
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44849121990
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Design and fabrication of MEMS thermoelectric generators with high temperature efficiency
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Jul./Aug.
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T. Huesgen, P. Woias, and N. Kockmann, "Design and fabrication of MEMS thermoelectric generators with high temperature efficiency," Sens. Actuators A, Phys., vol. 145/146, pp. 423-429, Jul./Aug. 2008.
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(2008)
Sens. Actuators A, Phys.
, vol.145-146
, pp. 423-429
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Huesgen, T.1
Woias, P.2
Kockmann, N.3
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4
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67650503593
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Automotive applications of thermoelectric materials
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Jul.
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J. Yang and F. Stabler, "Automotive applications of thermoelectric materials," J. Electron. Mater., vol. 38, no. 7, pp. 1245-1251, Jul. 2009.
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(2009)
J. Electron. Mater.
, vol.38
, Issue.7
, pp. 1245-1251
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Yang, J.1
Stabler, F.2
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5
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34249774582
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Conversion efficiency of thermoelectric combustion systems
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DOI 10.1109/TEC.2006.877375
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G. Min and D. M. Rowe, "Conversion efficiency of thermoelectric combustion systems," IEEE Trans. Energy Convers., vol. 22, no. 2, pp. 528-534, Jun. 2007. (Pubitemid 46845653)
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(2007)
IEEE Transactions on Energy Conversion
, vol.22
, Issue.2
, pp. 528-534
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Min, G.1
Rowe, D.M.2
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6
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77956326212
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Enhancement of automotive exhaust heat recovery by thermoelectric devices
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Aug.
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E. A. Ibrahim, J. P. Szybist, and J. E. Parks, "Enhancement of automotive exhaust heat recovery by thermoelectric devices," J. Automobile Eng., vol. 224, no. 8, pp. 1097-1111, Aug. 2010.
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(2010)
J. Automobile Eng.
, vol.224
, Issue.8
, pp. 1097-1111
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Ibrahim, E.A.1
Szybist, J.P.2
Parks, J.E.3
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8
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84856252123
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Rapid fabrication of smart tooling with embedded sensors by casting in molds made by three dimensional printing
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J. Kobliska, P. Ostojic, X. Cheng, X. Zhang, H. Choi, Y. Yang, and X. Li, "Rapid fabrication of smart tooling with embedded sensors by casting in molds made by three dimensional printing," in Proc. SFF Symp., 2005, pp. 468-475.
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(2005)
Proc. SFF Symp.
, pp. 468-475
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Kobliska, J.1
Ostojic, P.2
Cheng, X.3
Zhang, X.4
Choi, H.5
Yang, Y.6
Li, X.7
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9
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34249878524
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Study on embedding and integration of microsensors into metal structures for manufacturing applications
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DOI 10.1115/1.2515456
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X. Cheng, A. Datta, H. Choi, X. Zhang, and X. Li, "Study on embedding and integration of microsensors into metal structures for manufacturing applications," J. Manuf. Sci. Eng., vol. 129, no. 2, pp. 416-424, 2007. (Pubitemid 46869422)
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(2007)
Journal of Manufacturing Science and Engineering, Transactions of the ASME
, vol.129
, Issue.2
, pp. 416-424
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Cheng, X.1
Datta, A.2
Choi, H.3
Zhang, X.4
Li, X.5
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10
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84856237263
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Intelligente gussteile-Einsatz adaptronischer Komponenten in Kombination mit Gussteilen
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M. Busse, F.-J. Wöstmann, T. Müller, T. Melz, and P. Spies, "Intelligente gussteile-Einsatz adaptronischer Komponenten in Kombination mit Gussteilen," Giesserei, vol. 93, no. 4, pp. 48-53, 2006.
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(2006)
Giesserei
, vol.93
, Issue.4
, pp. 48-53
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Busse, M.1
Wöstmann, F.-J.2
Müller, T.3
Melz, T.4
Spies, P.5
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11
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84907407516
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In-process-embedding of piezo sensors and RFID transponders into cast parts for autonomous manufacturing logistics
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T. Gessner, Ed.
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C. Pille, "In-process-embedding of piezo sensors and RFID transponders into cast parts for autonomous manufacturing logistics," in Proc. Smart Syst. Integr., T. Gessner, Ed., 2010, pp. 1-10.
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(2010)
Proc. Smart Syst. Integr.
, pp. 1-10
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Pille, C.1
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12
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33745865152
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A high-temperature thermopile fabrication process for thermal flow sensors
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DOI 10.1016/j.sna.2006.02.009, PII S092442470600104X
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R. Buchner, C. Sosna, M. Maiwald, W. Benecke, and W. Lang, "A hightemperature thermopile fabrication process for thermal flow sensors," Sens. Actuators A, Phys., vol. 130/131, pp. 262-266, Aug. 2006. (Pubitemid 44037361)
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(2006)
Sensors and Actuators, A: Physical
, vol.130-131
, Issue.SPEC. ISS.
, pp. 262-266
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Buchner, R.1
Sosna, C.2
Maiwald, M.3
Benecke, W.4
Lang, W.5
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13
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0026370925
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Corner compensation techniques in anisotropic etching of (100)-silicon using aqueous KOH
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Jun. 24-27
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H. Sandmaier, H. L. Offereins, K. Kuhl, and W. Lang, "Corner compensation techniques in anisotropic etching of (100)-silicon using aqueous KOH," in Proc. Int. Conf. Solid-State Sens. Actuators, Dig. Tech. Papers, TRANSDUCERS, Jun. 24-27, 1991, pp. 456-459.
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(1991)
Proc. Int. Conf. Solid-State Sens. Actuators, Dig. Tech. Papers, TRANSDUCERS
, pp. 456-459
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Sandmaier, H.1
Offereins, H.L.2
Kuhl, K.3
Lang, W.4
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14
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65949120216
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A stretchable cell culture platform with embedded electrode array
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P. Wei, R. Taylor, Z. Ding, G. Higgs, J. J. Norman, B. L. Pruitt, and B. Ziaie, "A stretchable cell culture platform with embedded electrode array," in Proc. IEEE 22nd Int. Conf. MEMS, 2009, pp. 407-410.
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(2009)
Proc. IEEE 22nd Int. Conf. MEMS
, pp. 407-410
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Wei, P.1
Taylor, R.2
Ding, Z.3
Higgs, G.4
Norman, J.J.5
Pruitt, B.L.6
Ziaie, B.7
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15
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80052304865
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From embedded sensors to sensorial materials-The road to function scale integration
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Nov.
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W. Lang, F. Jakobs, E. Tolstosheeva, A. Ibragimov, H. Sturm, A. Kesel, D. Lehmhus, and U. Dicke, "From embedded sensors to sensorial materials-The road to function scale integration," Sens. Actuators A, Phys., vol. 171, no. 1, pp. 3-11, Nov. 2011.
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(2011)
Sens. Actuators A, Phys.
, vol.171
, Issue.1
, pp. 3-11
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Lang, W.1
Jakobs, F.2
Tolstosheeva, E.3
Ibragimov, A.4
Sturm, H.5
Kesel, A.6
Lehmhus, D.7
Dicke, U.8
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16
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84856252122
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Semi-analytical model for the Seebeck coefficient in nondegenerated semiconductors with isotropic density of states given by a power function
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to be published
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A. Ibragimov, "Semi-analytical model for the Seebeck coefficient in nondegenerated semiconductors with isotropic density of states given by a power function," J. Appl. Phys., to be published.
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J. Appl. Phys.
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Ibragimov, A.1
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