A thermoelectric energy harvester directly embedded into casted aluminum

IEEE Electron Device Letters

Volumn 33, Issue 2, 2012, Pages 233-235

  Ibragimov, Azat ^a   Pleteit, Hermann ^b   Pille, Christoph ^b   Lang, Walter ^a  

^a UNIVERSITY OF BREMEN   (Germany)

^b FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

Aluminum casting; embedded microsystem; energy harvesting; high pressure die casting (HPDC); thermoelectric generator (TG); thermogenerator

Indexed keywords

ELECTRIC POWER; HIGH TEMPERATURE STABILITY; HIGH-PRESSURE DIE CASTING; LIQUID ALUMINUM; THERMOELECTRIC ENERGY; THERMOELECTRIC GENERATORS; THERMOGENERATOR;

ALUMINUM CASTINGS; DIE CASTING; ENERGY HARVESTING; LIQUID METALS; METAL CASTING; MICROSYSTEMS; THERMOCOUPLES; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY;

ALUMINUM;

EID: 84856270051     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2011.2174605     Document Type: Article

References (16)

1. H. Glosch, M. Ashauer, U. Pfeiffer, and W. Lang, "A thermoelectric converter for energy supply," Sens. Actuators A, Phys., vol. 74, no. 1-3, pp. 246-250, Apr. 1999.
2. T. Huesgen, P. Woias, and N. Kockmann, "Design and fabrication of MEMS thermoelectric generators with high temperature efficiency," Sens. Actuators A, Phys., vol. 145/146, pp. 423-429, Jul./Aug. 2008.
3. D. Rowe, Thermoelectrics Handbook: Macro to Nano. Boca Raton, FL: CRC Press, 2006.
4. J. Yang and F. Stabler, "Automotive applications of thermoelectric materials," J. Electron. Mater., vol. 38, no. 7, pp. 1245-1251, Jul. 2009.
5. G. Min and D. M. Rowe, "Conversion efficiency of thermoelectric combustion systems," IEEE Trans. Energy Convers., vol. 22, no. 2, pp. 528-534, Jun. 2007. (Pubitemid 46845653)
6. E. A. Ibrahim, J. P. Szybist, and J. E. Parks, "Enhancement of automotive exhaust heat recovery by thermoelectric devices," J. Automobile Eng., vol. 224, no. 8, pp. 1097-1111, Aug. 2010.
7. D. Marshall, J. Hallmark, andW. Ooms, "Thermoelectric power generator and method of generating thermoelectric power in a steam power cycle utilizing latent steam heat," U. S. Patent 6 367 261 B1, Apr. 9, 2002.
8. J. Kobliska, P. Ostojic, X. Cheng, X. Zhang, H. Choi, Y. Yang, and X. Li, "Rapid fabrication of smart tooling with embedded sensors by casting in molds made by three dimensional printing," in Proc. SFF Symp., 2005, pp. 468-475.
9. X. Cheng, A. Datta, H. Choi, X. Zhang, and X. Li, "Study on embedding and integration of microsensors into metal structures for manufacturing applications," J. Manuf. Sci. Eng., vol. 129, no. 2, pp. 416-424, 2007. (Pubitemid 46869422)
10. M. Busse, F.-J. Wöstmann, T. Müller, T. Melz, and P. Spies, "Intelligente gussteile-Einsatz adaptronischer Komponenten in Kombination mit Gussteilen," Giesserei, vol. 93, no. 4, pp. 48-53, 2006.
11. C. Pille, "In-process-embedding of piezo sensors and RFID transponders into cast parts for autonomous manufacturing logistics," in Proc. Smart Syst. Integr., T. Gessner, Ed., 2010, pp. 1-10.
12. R. Buchner, C. Sosna, M. Maiwald, W. Benecke, and W. Lang, "A hightemperature thermopile fabrication process for thermal flow sensors," Sens. Actuators A, Phys., vol. 130/131, pp. 262-266, Aug. 2006. (Pubitemid 44037361)
13. H. Sandmaier, H. L. Offereins, K. Kuhl, and W. Lang, "Corner compensation techniques in anisotropic etching of (100)-silicon using aqueous KOH," in Proc. Int. Conf. Solid-State Sens. Actuators, Dig. Tech. Papers, TRANSDUCERS, Jun. 24-27, 1991, pp. 456-459.
14. P. Wei, R. Taylor, Z. Ding, G. Higgs, J. J. Norman, B. L. Pruitt, and B. Ziaie, "A stretchable cell culture platform with embedded electrode array," in Proc. IEEE 22nd Int. Conf. MEMS, 2009, pp. 407-410.
15. W. Lang, F. Jakobs, E. Tolstosheeva, A. Ibragimov, H. Sturm, A. Kesel, D. Lehmhus, and U. Dicke, "From embedded sensors to sensorial materials-The road to function scale integration," Sens. Actuators A, Phys., vol. 171, no. 1, pp. 3-11, Nov. 2011.
16. A. Ibragimov, "Semi-analytical model for the Seebeck coefficient in nondegenerated semiconductors with isotropic density of states given by a power function," J. Appl. Phys., to be published.