Lead-free bonding process using Ag nanoparticles for high temperature packaging;Lead-free bonding process using Ag nanoparticles for high temperature packaging

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 54, Issue 10, 2005, Pages 999-1004

  Ide, Eiichi ^a   Hirose, Akio ^a   Kobayashi, Kojiro F ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Bonding to Cu; Lead free high melting point solder; Nanoparticle; Shear strength; Sintering

Indexed keywords

BONDING TO CU; FRACTURE SURFACES; LEAD-FREE HIGH MELTING POINT SOLDERS; NANOPARTICLES;

FRACTURE; HIGH TEMPERATURE EFFECTS; LEAD; MELTING; NANOSTRUCTURED MATERIALS; PACKAGING; SHEAR STRENGTH; SILVER; SINTERING; SOLDERING;

BONDING;

EID: 29144497264     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.54.999     Document Type: Article

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