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Increasing microprocessor performance is associated with an increased cooling demand. Effective heat dissipation has become a key issue for further development of high performance semiconductor devices. Currently, VACNT application for thermal management is being extensively studied in industry. In our private communications with thermal engineers in Intel and Samsung, we all find the values in literature regarding intrinsic thermal transport property of VACNTs and resistance of VACNT TIMs are so puzzling and conflicting.
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