Fabrication of two-layer flexible copper clad laminate by electroless-Cu plating on surface modified polyimide

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 19, Issue 4, 2009, Pages 970-974

  HWANG, Soo Min ^a   LIM, Jun Hyung ^a   LEE, Chang Min ^a   PARK, Eui Cheol ^a   CHOI, Jun Hyuk ^a   JOO, Jinho ^a   LEE, Hoo Jeong ^a   JUNG, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

adhesion strength; electroless Cu plating; flexible clad laminate; X ray photoelectron spectroscopy

Indexed keywords

ACTIVATED SURFACES; ADHESION STRENGTH; ADHESION STRENGTHS; ELECTROLESS; ELECTROLESS-CU PLATING; FLEXIBLE CLAD LAMINATE; FLEXIBLE COPPER CLAD LAMINATE; INTERFACIAL CONDITIONS; INTERFACIAL MORPHOLOGIES; NUCLEATION SITES; PEEL STRENGTH; PLATING PROCESS; PRE-TREATMENT; SPUTTERING PROCESS; SURFACE-MODIFIED; TWO LAYERS;

ADHESION; ADSORPTION; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BOND STRENGTH (MATERIALS); CATALYSIS; CATALYSTS; INORGANIC COATINGS; LAMINATES; PALLADIUM; PHOTOELECTRICITY; PHOTOIONIZATION; PHOTONS; PLATING; POLYIMIDES; SURFACE ROUGHNESS;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 68549088837     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(08)60388-X     Document Type: Article

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