MEMS technology integrated in the CMOS back end

Microelectronics Reliability

Volumn 50, Issue 9-11, 2010, Pages 1593-1598

  Gaddi, R ^a   Van Kampen, R ^a   Unamuno, A ^a   Joshi, V ^b   Lacey, D ^b   Renault, M ^b   Smith, C ^b   Knipe, R ^b   Yost, D ^b  

^a Cavensish Kinetics BV   (Netherlands)

^b Cavendish Kinetics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPETITIVE COSTS; HARSH ENVIRONMENT; INTEGRATION APPROACH; MEMS TECHNOLOGY; MEMSDEVICES; PACKAGING DEVELOPMENT;

TECHNOLOGY;

EID: 84755161072     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.113     Document Type: Conference Paper

References (7)

1. Gaddi R et al. Reliability of RF-MEMS. In: Proc 13th GAAS symposium, October 3-7, Paris, France; 2005. p. 269-72.
2. Hornbeck LJ. Digital light processing and MEMS: timely convergence for a bright future, plenary session, SPIE micromachining and microfabrication '95, Austin, Texas, October 24; 1995.
3. Block C. Advanced RF frontend solutions with RF-MEMS. In: Trade press conference, July 23, Deutschlandsberg, Austria; 2008.
4. Joshi V et al. A non volatile MEMS switch for harsh environment memory applications. In: IMAPS int conf exhib on high temperature electronics network (HiTEN), September 13-16, Oxford, UK; 2009.
5. Joshi V et al. A CMOS compatible back end MEMS switch for logic functions. In: 2010 IEEE int interconnect technology conference IITC, June 7-9, San Francisco, CA, USA; 2010.
6. Zunino III JL et al. Micro-electromechanical systems (MEMS) reliability assessment program for department of defense activities. In: Proc 2005 NSTI nanotechnology conference and trade show (Nanotech), vol. 3. Anaheim, CA, May 8-12; 2005. p. 463-466.
7. G.M. Rebeiz RF MEMS theory, design, and technology 2003 Wiley New York