A non volatile MEMS switch for harsh environment memory applications

Proceedings - 2009 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2009

Volumn , Issue , 2009, Pages 136-141

  Joshi, Vikram ^a   Smith, Charles ^a   Gaddi, Roberto ^a   Lacey, Damian ^a   Nagata, Toshi ^a   Renault, Mickael ^a   Unamuno, Anartz ^a   Van Kampen, Rob ^a   Knipe, Richard ^a   Yost, Dennis ^a  

^a Cavendish Kinetics Inc   (United States)

Author keywords

Bi stable latch; High temperature; Non volatile memory; Radiation hard and MEMS

Indexed keywords

BISTABLES; HIGH TEMPERATURE; INTERCONNECT PROCESSING; MEMORY APPLICATIONS; NON-VOLATILE MEMORY; OPERATING TEMPERATURE RANGES; RADIATION HARD; VOLTAGE OPERATIONS;

DATA STORAGE EQUIPMENT; ELECTRIC SWITCHES; METALS;

REFRACTORY METALS;

EID: 84876938165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Beunder MA, Kampen RV, Lacey D, Renault M, Smith CG. "A new embedded NVM technology for low power, high temperature, rad hard applications." Proc Non-volatile Memory Tech Symp pp 65-8, 2005:
2. Pathak, J.; Thomas, M.; Payne, J.; Schatzberger, G.; Wiesner, A.; Leisenberger, F.; Wachmann, E.; Schrems, M., "Embedded Non-Volatile memory modules for low voltage and high temperature applications". IEEE Non-Volatile Semiconductor Memory Workshop, Vol. 21, pp 27-30, 12-16 February. 2006.
3. Charles G. Smith. Rob van Kampen, Jens Popp, Damian Lacy, Don Pinchetti, Michael Renault, Vikram Joshi, Mike A. Beunder, "Nanomechanical cantilever arrays for low-power and low-voltage embedded nonvolatile memory applications" Proc. SPIE, Vol. 6464, pp 646406 (2007)
4. J. R. Murray, "Design considerations for a radiation hardened nonvolatile memory", IEEE Transactions on Nuclear Science, Snowbird, UT, USA, Vol. 40, No 6, pp 1610-1618, 19-23 July 1993.