Adhesion strength study of IBAD-MOCVD-based 2G HTS wire using a peel test

Physica C: Superconductivity and its Applications

Volumn 473, Issue 1, 2012, Pages 41-47

  Zhang, Y ^a   Hazelton, D W ^a   Knoll, A R ^a   Duval, J M ^a   Brownsey, P ^a   Repnoy, S ^a   Soloveichik, S ^a   Sundaram, A ^a   McClure, R B ^a   Majkic, G ^b   Selvamanickam, V ^b  

^a SUPERPOWER INC   (United States)

^b UNIVERSITY OF HOUSTON   (United States)

Author keywords

2G HTS wire; Adhesion strength; HTS magnetic coil; Peel strength; Peel test; Thermal stress

Indexed keywords

ADHESION STRENGTHS; HTS WIRES; MAGNETIC COIL; PEEL STRENGTH; PEEL TESTS;

BOND STRENGTH (MATERIALS); PEELING; TESTING; THERMAL STRESS; WIRE;

ADHESION;

EID: 84055187738     PISSN: 09214534     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physc.2011.11.013     Document Type: Article

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