Adhesion strength and peeling angle measured on the polyimide/Cr interfaces

Materials Research Society Symposium - Proceedings

Volumn 629, Issue , 2000, Pages

  Choi, J W ^a   Lee, K E ^a   Oh, T S ^a  

^a Hong Ik University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMINES; BENDING (DEFORMATION); CHROMIUM; COPPER; MATERIALS TESTING; METALLIC FILMS; POLYIMIDES; YIELD STRESS;

ADHESION STRENGTH; PEELING ANGLE; PLASTIC BENDING; T PEEL TEST;

INTERFACES (MATERIALS);

EID: 0034444982     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)