Thermal peeling stress analysis of thin-film high-Tc superconductors

Applied Superconductivity

Volumn 6, Issue 1, 1998, Pages 19-29

  Gu, Bei ^a   Phelan, Patrick E ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HIGH TEMPERATURE SUPERCONDUCTORS; MATHEMATICAL MODELS; PEELING; SUBSTRATES; SUPERCONDUCTING TRANSITION TEMPERATURE; TENSILE STRESS; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS;

STRESS SINGULARITY; THERMAL PEELING STRESS;

SUPERCONDUCTING FILMS;

EID: 0031644360     PISSN: 09641807     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0964-1807(98)00043-X     Document Type: Article

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