Study of temperature dependence of bump bonding for the BTeV pixel detector

IEEE Transactions on Nuclear Science

Volumn 51, Issue 5 I, 2004, Pages 2161-2167

  Turqueti, M ^a   Cihangir, S ^a   Kwan, S ^a   Appel, J A ^a   Cardoso, G ^a   Christian, D C ^a   Hall, B K ^a   Zimmermann, S ^a  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

Bump bonding; Pixel detector; Thermal cycle

Indexed keywords

GRAPHITE; INDIUM; SILICON SENSORS; SOLDERING ALLOYS; SPURIOUS SIGNAL NOISE; THERMAL CYCLING; THERMAL EFFECTS;

BUMP BONDING; BUMP RESISTANCE; PIXEL DETECTORS; READOUT CHIPS;

GAS DETECTORS;

EID: 8344264675     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2004.834709     Document Type: Article

References (7)

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2. S. Kwan, J. A. Appel, D. Christian, G. Chiodini, S. Cihangir, F. Reygadas, and C. Newsom, "A study of thermal cycling and radiation effects on indium and solder bump bonds," in Proc. IEEE Nuclear Science Symp., 2001, FERMILAB-CONF-01-377-E.
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5. G. Cardoso, J. Andresen, J. A. Appel, D. C. Christian, G. Chiodini, B. K. Hall, S. Kwan, M. Turqueti, and S. Zimmermann, "Pixel multichip module design for a high energy physics experiment," in Proc. IEEE Nuclear Science Symp., 2003, Fermilab-CONF-03-360E.
6. M. R. Coluccia, J. A. Appel, G. Chiodini, D. C. Christian, and S. W. Kwan, "Characterization of prototype BTeV silicon pixel sensors before and after irradiation," IEEE Trans. Nucl. Sci., vol. 49, pp. 1743-1749, Aug. 2002.
7. M. Turqueti, J. A. Appel, G. Cardoso, D. C. Christian, S. Cihangir, B. K. Hall, S. Kwan, and S. Zimmermann, "Temperature dependence of pixel multichip module operating performance," in Proc. IEEE Nuclear Science Symp., 2003, FERMILAB-PUB-03-361-E.