Temperature dependence of pixel multichip module operating performance

IEEE Nuclear Science Symposium Conference Record

Volumn 1, Issue , 2003, Pages 581-585

  Turqueti, M A ^a   Appel, J A ^a   Catdoso, G ^a   Christian, D C ^a   Cihangir, S ^a   Hall, B K ^a   Kwan, S ^a   Zimmermann, S ^a,b  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENCHMARKING; DATA TRANSFER; PRINTED CIRCUIT BOARDS; RADIATION DAMAGE; SENSORS; THERMAL EXPANSION;

COLLIDING BEAMS; PIXEL MULTICHIP; SILICON PIXEL SENSORS;

MULTICHIP MODULES;

EID: 11844300447     PISSN: 10957863     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/nssmic.2003.1352109     Document Type: Conference Paper

References (6)

1. G. Cardoso, et al., Pixel Multichip Module Design for a High Energy Physics Experiment, Nuclear Science Symposium, Portland, USA, Oct. 19-Oct.24, 2003, Fermilab-CONF 03-360E.
2. Christian, D., et al. Development of a pixel readout chip for BTeV, Nucl. Instrum. Meth. A435, pp. 144-152, 1999.
3. S.Kwan, et al. Study of Indium and Soldier Bumps for the BteV Pixel Detector. Nuclear Science Symposium, Portland, USA, Oct.19-Oct.24, 2003, Fermilab CONF - 03/363E.
4. M.R. Coluccia, J.A. Appel, G. Chiodini. D.C. Christian and S.W. Kwan, "Characterization of prototype BTeV silicon pixel sensors before and after irradiation." IEEE Trans. Nucl. Sci. vol. 49. no. 4, pp. 1743-1749, 2002.
5. D. C. Christian, J. A. Appel, G. Cancelo, S. W. Kwan, J. Hoff, A. Mekkaoui, et. Al, "Development of a pixel read out chip for BTeV," Nucl. Instrum. Methods, vol. A 335, pp. 144-152, 1999.
6. S. Cihangir and S. Kwan, "Characterization of indium and solder bump bonding for pixel detector," Nucl. Instrum. Methods. Vol. A476, pp. 670 (2002).