Pixel multichip module design for a high energy physics experiment

IEEE Nuclear Science Symposium Conference Record

Volumn 1, Issue , 2003, Pages 68-72

  Cardoso, G ^a   Andresen, J ^a   Appel, J A ^a   Chiodini, G ^a   Christian, D C ^a   Hall, B K ^a   Kwan, S W ^a   Turqueti, M A ^a   Zimmermann, S ^b  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANALOG TO DIGITAL CONVERSION; BONDING; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; READOUT SYSTEMS; SOLDERING;

BTEV EXPERIMENT; PIXEL DETECTORS; PIXEL MULTICHIP MODULE DESIGN; READOUT INTEGRATED CIRCUITS;

HIGH ENERGY PHYSICS;

EID: 11844288300     PISSN: 10957863     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/nssmic.2003.1352000     Document Type: Conference Paper

References (8)

1. BTeV collaboration: Proposal for an Experiment to measure Mixing, CP Violation, and Rare Decays in Charm and Beauty Particle Decays at Fermilab Collider, (2000), http://www-btev.fnal.gov/public_documents/btev_proposal/index. html.
2. st ECTC, Orlando, Florida, May 28-31, 2001.
3. Christian, D.C., et al., "Development of a pixel readout chip for BTeV," Nucl. Instr. and Meth. A 435, pp.144-152, 1999.
4. Hall, B., et al., "Development of a Readout Technique for the High Data Rate BTeV Pixel Detector at Fermilab", Proceedings of the 2001 IEEE Nuclear Science Symposium, San Diego, November 4-10, 2001.
5. th Workshop on Electronics for LHC Experiments, Snowmass, Colorado, September 20-24, 1999.
6. Thermally Conductive Adhesive Transfer Tapes, Technical datasheet, 3M. April 1999.
7. Abt, I., et al., "Gluing Silicon with Silicone", Nucl. Instr. and Meth. A 411, pp. 191-196, 1998.
8. Kwan, S., et al., "Study of Indium and Solder Bumps for the BTeV Pixel Detector", Proceedings of the 2003 IEEE Nuclear Science Symposium, Portland, October 19-24, 2003.