An incremental clustering based solder joint inspection algorithm for chip component

Journal of Computational Information Systems

Volumn 7, Issue 14, 2011, Pages 5193-5200

  Xie, Hongwei ^a   Kuang, Yongcong ^a   Ouyang, Gaofei ^a   Zhang, Xianmin ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Adaptive ability; Incremental clustering; Representative samples; Solder joint inspection

Indexed keywords

ADAPTIVE ABILITY; AUTOMATIC OPTICAL INSPECTION; CHIP COMPONENT; DATA SETS; FALSE ALARM RATE; FALSE ALARMS; INCREMENTAL CLUSTERING; INCREMENTAL CLUSTERING ALGORITHM; PRODUCTION ENVIRONMENTS; RECOGNITION RATES; REPAIR STATIONS; REPRESENTATIVE SAMPLE; REPRESENTATIVE SAMPLES; SOLDER JOINT INSPECTION; SOLDER JOINTS; TRAINING EFFICIENCY;

ERRORS; INSPECTION; OPTICAL TESTING;

CLUSTERING ALGORITHMS;

EID: 83255186939     PISSN: 15539105     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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