Pattern classification of solder joint images using a correlation neural network

Engineering Applications of Artificial Intelligence

Volumn 9, Issue 6, 1996, Pages 655-669

  Kim, J H ^a   Cho, H S ^b   Kim, S ^b  

^a SAMSUNG Electronics   (South Korea)

^b NONE

Author keywords

Circular tiered illumination system; Neural network; Printed circuit board; Solder joint inspection; Surface mounting technology

Indexed keywords

CORRELATION METHODS; LEARNING SYSTEMS; PATTERN RECOGNITION; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

CIRCULAR TIERED ILLUMINATION SYSTEM; FUNCTIONAL LINK NET; SOLDER JOINT IMAGES;

NEURAL NETWORKS;

EID: 0030405890     PISSN: 09521976     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0952-1976(96)00046-2     Document Type: Article

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