Die separation strength for deep reactive ion etched wafers

Conference Proceedings of the Society for Experimental Mechanics Series

Volumn 6, Issue , 2011, Pages 383-391

  Porter, D A ^a   Berfield, T A ^a  

^a University of Louisville   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICS; SEPARATION;

BACKSIDE GRINDING; DEEP REACTIVE ION ETCHED; DEEP REACTIVE ION ETCHING; MICROFABRICATION INDUSTRY; PROTECTIVE MASKS; SEPARATION METHODS; SEPARATION TECHNIQUES; THREE POINT BENDING;

DIES;

EID: 82255184202     PISSN: 21915644     EISSN: 21915652     Source Type: Conference Proceeding    
DOI: 10.1007/978-1-4419-9792-0_62     Document Type: Conference Paper

References (8)

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8. 6 flow rate on the etched surface profile and bottom grass formation in deep reactive ion etching process", Journal of Physics: Conference Series, 34, p. 577-582, 2006.