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Volumn 34, Issue 11, 2003, Pages 1067-1074

Development of a chip-integrated micro cooling device

Author keywords

EHD; Electrohydrodynamics; Electronic cooling; Micro cooling device; Micropump; Polarization; Thin film evaporation

Indexed keywords

MICRO COOLING DEVICE;

EID: 0142216265     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2003.09.010     Document Type: Article
Times cited : (109)

References (12)
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  • 2
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  • 4
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    • (1995) Cooling and Thermal Design of Electronic Systems , vol.319 , Issue.15 , pp. 117-121
    • Youngcheol, J.1    Kiet, D.2    Chang, J.K.3
  • 5
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    • Cooling of electronics by heat pipes and thermosyphons
    • New York: ASME
    • Bjorn P., Niklas T. Cooling of electronics by heat pipes and thermosyphons. National Heat Transfer Conference. vol. 329(7):1996;ASME, New York. p. 97-108.
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    • Bjorn, P.1    Niklas, T.2
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    • Phase change in microchannel heat sinks with integrated temperature sensors
    • Jiang L., Wong M., Zohar Y. Phase change in microchannel heat sinks with integrated temperature sensors. J. Microelectromech. Syst. 8:(4):1999;358-365.
    • (1999) J. Microelectromech. Syst. , vol.8 , Issue.4 , pp. 358-365
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.