Elevated temperature nanoindentation behaviour of polyamide 6

Polymer International

Volumn 60, Issue 12, 2011, Pages 1753-1761

  Seltzer, Rocio ^a   Kim, Jang Kyo ^b   Mai, Yiu Wing ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Adhesion; High temperature; Nanoindentation; Plasticity; Polyamide 6; Pressure dependence

Indexed keywords

APPLIED LOADS; ELEVATED TEMPERATURE; HIGH TEMPERATURE; HYDROSTATIC STRESS; INDENTATION DEPTH; INDENTATION MODULUS; INDENTERS; NANOMECHANICAL PROPERTY; POLYAMIDE 6; PRESSURE DEPENDENCE;

ADHESION; GLASS TRANSITION; HYDRAULICS; HYDRODYNAMICS; HYDROSTATIC PRESSURE; INDENTATION; PLASTICITY;

NANOINDENTATION;

EID: 81855168251     PISSN: 09598103     EISSN: 10970126     Source Type: Journal    
DOI: 10.1002/pi.3146     Document Type: Article

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