SCOPUS 정보 검색 플랫폼

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 52-56

Design and optimization of redistribution layer (RDL) on TSV interposer for high frequency applications

(7) Cui, Qinghu a Sun, Xin a Zhu, Yunhui a Ma, Shenglin a Chen, Jing a Miao, Min a,b Jin, Yufeng a

a PEKING UNIVERSITY (China)

b BEIJING INFORMATION SCIENCE AND TECHNOLOGY UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ANSOFT HFSS; CYCLOTENE; DESIGN AND OPTIMIZATION; DOUBLE LAYERS; HIGH-FREQUENCY APPLICATIONS; METAL LAYER; METAL LINE; PASSIVATION LAYER; REDISTRIBUTION LAYERS; RETURN LOSS; SIGNAL TRANSMISSION; SINGLE LAYER; SYSTEM RELIABILITY;

ADHESION; ELECTRON BEAMS; ELECTRONICS PACKAGING; MULTILAYERS; OPTIMIZATION;

PACKAGING;

EID: 81355153352 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2011.6066788 Document Type: Conference Paper

Times cited : (12)

References (7)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.