Recent developments in TEM applications for the IC industry

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2008, Pages 14-20

  Fu, L F ^a   Wang, Y C ^a   Jiang, B ^a   Shen, F ^a   Strauss, M ^a   Van Leer, B ^a   Senowitz, C ^a   Buxbaum, A ^a  

^a Thermo Fisher Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABERRATION CORRECTORS; GATE OXIDES; IC INDUSTRIES; IMAGE ABERRATIONS; SEMICONDUCTOR CHARACTERIZATIONS; TEM;

ABERRATIONS; ELECTRON MICROSCOPES; GATE DIELECTRICS; INTEGRATED CIRCUITS; QUALITY ASSURANCE; SAFETY FACTOR; TRANSMISSION ELECTRON MICROSCOPY;

FAILURE ANALYSIS;

EID: 80655127894     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1361/cp2008istfa014     Document Type: Conference Paper

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