Pop-up book MEMS

Journal of Micromechanics and Microengineering

Volumn 21, Issue 11, 2011, Pages

  Whitney, J P ^a   Sreetharan, P S ^a   Ma, K Y ^a   Wood, R J ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEX PARTS; COMPLIANT LAYER; DEGREE OF FREEDOM; DESIGN METHODOLOGY; DEVICE LAYERS; FLEXURE MECHANISM; FOLDING MECHANISM; MANUFACTURING PROCESS; MECHANICAL ALIGNMENT; PAPER ENGINEERING; RIGID-FLEX; SELF-ASSEMBLING STRUCTURE; THREE-DIMENSIONAL MICROSTRUCTURES;

MECHANISMS;

PRINTED CIRCUIT BOARDS;

EID: 80555131704     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/11/115021     Document Type: Article

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