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Volumn 401, Issue 8, 2011, Pages 2657-2665

Hot embossing and thermal bonding of poly(methyl methacrylate) microfluidic chips using positive temperature coefficient ceramic heater

(3) Wang, Xia a Zhang, Luyan a Chen, Gang a

a FUDAN UNIVERSITY (China)

Author keywords

Embossing; Microchip electrophoresis; Poly(methyl methacrylate); Positive temperature coefficient ceramic

Indexed keywords

CERAMIC HEATERS; CHANNEL NETWORK; CONSTANT TEMPERATURE; ELECTRICAL CONTROL; ELECTROPHORETIC SEPARATIONS; EMBOSSING; GLASS SLIDES; HEATING DEVICES; HIGH QUALITY; HOT-EMBOSSING; MICROCHIP ELECTROPHORESIS; MICROFLUIDIC CHIP; THERMAL BONDING; THERMOPLASTIC POLYMER;

CERAMIC MATERIALS; ELECTROPHORESIS; ESTERS; FLUIDIC DEVICES; HEATING; MICROFLUIDICS; MICROPROCESSOR CHIPS; POSITIVE TEMPERATURE COEFFICIENT; PRESSES (MACHINE TOOLS);

LOW TEMPERATURE PRODUCTION;

CATION; POLY(METHYL METHACRYLATE);

ARTICLE; CERAMICS; CHEMISTRY; EQUIPMENT DESIGN; HEAT; HEATING; INSTRUMENTATION; ISOLATION AND PURIFICATION; MICROCHIP ELECTROPHORESIS;

CATIONS; CERAMICS; ELECTROPHORESIS, MICROCHIP; EQUIPMENT DESIGN; HEATING; HOT TEMPERATURE; POLYMETHYL METHACRYLATE;

EID: 80255123902 PISSN: 16182642 EISSN: 16182650 Source Type: Journal
DOI: 10.1007/s00216-011-5377-5 Document Type: Article

Times cited : (18)

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