A spring-driven press device for hot embossing and thermal bonding of PMMA microfluidic chips

Electrophoresis

Volumn 31, Issue 15, 2010, Pages 2512-2519

  Chen, Zhi ^a   Zhang, Luyan ^a   Chen, Gang ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

Bonding; Embossing; Microfluidic chip; PMMA; Press device

Indexed keywords

GLASS; GLASS BONDING; MICROFLUIDICS; PRESSES (MACHINE TOOLS); SCREWS; SILICONES;

BONDING; CLAMPING PLATES; EMBOSSING; GLASS SLIDES; HOT-EMBOSSING; MICROFLUIDIC-CHIPS; PMMA; PRESS DEVICE; SIMPLE++; THERMAL BONDING;

MICROFLUIDIC CHIPS;

CATION; GLASS; POLY(METHYL METHACRYLATE); RUBBER; SILICON;

ARTICLE; BIOCHIP; CONTROLLED STUDY; DEVICE; ELECTROPHORESIS; MICROFLUIDICS; NANOFABRICATION; PRESS DEVICE; PRESSURE GRADIENT; SEPARATION TECHNIQUE; THERMAL CONDUCTIVITY;

EID: 77954971417     PISSN: 01730835     EISSN: 15222683     Source Type: Journal    
DOI: 10.1002/elps.201000084     Document Type: Article

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