Effect of current density and grain refining agents on pulsed electrodeposition of nanocrystalline nickel

Surface Engineering

Volumn 27, Issue 9, 2011, Pages 642-648

  Bhardwaj, M ^a   Balani, K ^b   Balasubramaniam, R ^b   Pandey, S ^b   Agarwal, A ^c  

^a INDIAN INSTITUTE OF TECHNOLOGY ROORKEE   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY KANPUR   (India)

^c Florida International University   (United States)

Author keywords

Coercivity; Complexing agent; Nanocrystalline nickel; Nanoindentation; Pulsed current electrodeposition

Indexed keywords

COMPLEXING AGENT; COPPER SUBSTRATES; CU SUBSTRATE; CURRENT EFFICIENCY; DEPOSITION BATH; DIRECT CURRENT; GRAIN REFINING; NANOCRYSTALLINE NICKEL; NANOMECHANICAL PROPERTY; ORGANIC ADDITIVES; PEAK CURRENT DENSITY; PULSED CURRENTS; PULSED ELECTRODEPOSITION; PULSED-CURRENT ELECTRODEPOSITION; SACCHARIN ADDITION; SODIUM CITRATE; WATT'S BATH; YOUNG'S MODULUS;

COERCIVE FORCE; CRYSTALLITE SIZE; CURRENT DENSITY; ELASTIC MODULI; ELASTICITY; ELECTRODEPOSITION; NANOINDENTATION; NICKEL; NICKEL REFINING; SODIUM; SUGAR SUBSTITUTES; SUGARS;

GRAIN REFINEMENT;

EID: 80155126712     PISSN: 02670844     EISSN: 17432944     Source Type: Journal    
DOI: 10.1179/026708410X12683118611185     Document Type: Article

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