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Volumn 171, Issue 2, 2011, Pages 414-420

A wireless and passive wafer cleanliness monitoring unit via electromagnetic coupling for semicondutcor/MEMS manufacturing facilities

Author keywords

Electromagnetic coupling; Passive sensing; Underwater sensing; Wafer cleanliness monitoring

Indexed keywords

CHEMICAL SENSING SYSTEMS; CONDUCTIVITY DATA; CONTROL SOLUTIONS; COUPLED POWER; ELECTROMAGNETIC (EM) COUPLING; FORM FACTORS; GLASS WAFER; IN-SITU; IN-SITU CHARACTERIZATION; INTER-DIGITATED ELECTRODES; MANUFACTURING FACILITY; MEMS CHEMICAL SENSORS; MICROFEATURES; ON-WAFER; PASSIVE SENSING; REAL TIME; RINSING PROCESS; RINSING WATER; SODIUM HYDROXIDES; UNDERWATER SENSING; WAFER CLEANLINESS MONITORING; WIRELESS SYSTEMS; WORKING DISTANCES;

EID: 80055061438     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2011.08.005     Document Type: Article
Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.