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Volumn 171, Issue 2, 2011, Pages 414-420
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A wireless and passive wafer cleanliness monitoring unit via electromagnetic coupling for semicondutcor/MEMS manufacturing facilities
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Author keywords
Electromagnetic coupling; Passive sensing; Underwater sensing; Wafer cleanliness monitoring
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Indexed keywords
CHEMICAL SENSING SYSTEMS;
CONDUCTIVITY DATA;
CONTROL SOLUTIONS;
COUPLED POWER;
ELECTROMAGNETIC (EM) COUPLING;
FORM FACTORS;
GLASS WAFER;
IN-SITU;
IN-SITU CHARACTERIZATION;
INTER-DIGITATED ELECTRODES;
MANUFACTURING FACILITY;
MEMS CHEMICAL SENSORS;
MICROFEATURES;
ON-WAFER;
PASSIVE SENSING;
REAL TIME;
RINSING PROCESS;
RINSING WATER;
SODIUM HYDROXIDES;
UNDERWATER SENSING;
WAFER CLEANLINESS MONITORING;
WIRELESS SYSTEMS;
WORKING DISTANCES;
APPROXIMATION THEORY;
CHEMICAL SENSORS;
ELECTROMAGNETIC COUPLING;
ELECTROMAGNETISM;
HYDROCHLORIC ACID;
MANUFACTURE;
SODIUM;
SULFURIC ACID;
TRANSPONDERS;
MONITORING;
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EID: 80055061438
PISSN: 09244247
EISSN: None
Source Type: Journal
DOI: 10.1016/j.sna.2011.08.005 Document Type: Article |
Times cited : (5)
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References (14)
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