|
Volumn 86, Issue 2, 2009, Pages 199-205
|
In situ and real-time metrology during rinsing of micro- and nano-structures
|
Author keywords
Cleaning; Metrology; Rinse model; Sensor; Wafer rinsing; Water usage
|
Indexed keywords
IMPURITIES;
MEASUREMENTS;
SENSORS;
TIME MEASUREMENT;
BULK WATERS;
CASE STUDIES;
CHARGE EFFECTS;
CHEMICAL RESIDUES;
FINE STRUCTURES;
IN-SITU;
KEY COMPONENTS;
METROLOGY;
METROLOGY METHODS;
NEW TECHNOLOGIES;
PATTERNED WAFERS;
PROCESS MODELS;
RESIDUAL IMPURITIES;
RINSE MODEL;
SENSOR HARDWARES;
SULFATE IONS;
SURFACE INTERACTIONS;
TESTING RESULTS;
TRANSPORT PROCESSES;
WAFER RINSING;
WAFER SURFACES;
WATER USAGE;
WATER TREATMENT;
|
EID: 58149240078
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2008.10.014 Document Type: Article |
Times cited : (11)
|
References (15)
|