Response surface modeling and evaluation of the influence of deposition parameters on the electrolytic Cu-Sn alloy powders production

Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science

Volumn 42, Issue 4, 2011, Pages 771-782

  Orhan, Gökhan ^a   Gezgin, Gizem Güzey ^a,b  

^a ISTANBUL UNIVERSITY   (Turkey)

^b Foxconn Turkey Company   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY POWDER; ALLOYED POWDER; CATHODIC CURRENT DENSITY; CATHODIC CURRENTS; CHEMICAL COMPOSITIONS; COPPER CONTENT; CU CONTENT; CU-SN ALLOYS; CURRENT EFFICIENCY; DEPOSITION PARAMETERS; ELECTRODEPOSITION PROCESS; ELECTROLYTE COMPOSITIONS; EMPIRICAL MODEL; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; INDUCTIVELY COUPLED PLASMA ANALYSIS; LOW CURRENT DENSITY; MECHANICAL STIRRING; MOLE RATIO; POSITIVE CORRELATIONS; POWDER MORPHOLOGY; PROCESS RESPONSE; RESPONSE SURFACE METHODOLOGY; RESPONSE SURFACE MODELING; SEM ANALYSIS; STIRRING SPEED; TRIPOLYPHOSPHATES;

ALLOYS; CERIUM ALLOYS; CHEMICAL ANALYSIS; CURRENT DENSITY; ELECTRODEPOSITION; ELECTROLYTES; ENERGY DISPERSIVE SPECTROSCOPY; INDUCTIVELY COUPLED PLASMA; MORPHOLOGY; POWDERS; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTIES; TIN; TIN ALLOYS; X RAY DIFFRACTION; X RAY POWDER DIFFRACTION;

COPPER ALLOYS;

EID: 80054953970     PISSN: 10735615     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11663-011-9510-9     Document Type: Article

References (29)

1. P.W. Lee, W.B. Eisen, B.L. Ferguson, R.M. German, R. Iacocca, D. Madan, H. Sanderow, and Y.T. Hardbound: ASM Metals Handbook Powder Metallurgy, 9th ed., vol. 7, ASM International, Materials Park, OH, 1998.
2. B. Subramanian, S. Mohan, and S. Jayakrishnan: Surf. Coat. Tech., 2006, vol. 201, pp. 1145-51.
3. D. Padhi, S.Gandikota,H.B.Nguyen,C.McGuirk, S.Ramanathan, J. Yahalom, and G. Dixit: Electrochim. Acta, 2003, vol. 48, pp. 935-43.
4. A.N. Correia, M.X. Façanha, and P. de Lima-Neto: Surf. Coat. Tech., 2007, vol. 201, pp. 7216-21.
5. W. Pu, X. He, J. Ren, C. Wan, and C. Jiang: Electrochim. Acta, 2005, vol. 50, pp. 4140-45.
6. Fu-S. Ke, L. Huang, Jin-S. Cai, and Shi-G. Sun: Electrochim. Acta, 2007, vol. 52, pp. 6741-47.
7. S.D. Beattie and J.R. Dahn: Electrochim. Acta, 2003, vol. 150, pp. A894-A898.
8. H.C. Shin and M. Liu: Adv. Funct. Mater., 2005, vol. 15, pp. 582-86.
9. L.D. Rafailović , W. Artner, G.E. Nauer, and D.M. Minić : Thermochim. Acta, 2009, vol. 496, pp. 110-16.
10. V.D. Jović , B.M. Jović , and M.G. Pavlović : Electrochim. Acta, 2006, vol. 51, pp. 5468-77.
11. V.D. Jović , B.M. Jović , V. Maksimović , and M.G. Pavlović : Electrochim. Acta, 2007, vol. 52, pp. 4254-63.
12. V.D. Jović , B.M. Jović , V.M. Maksimović , and M.G. Pavlović : Electrochim. Acta, 2008, vol. 53, pp. 4796-4804.
13. U. Lacnjevac, B.M. Jović , Z. Bascarević , V.M. Maksimović , and V.D. Jović : Electrochim. Acta, 2009, vol. 54, pp. 3115-23.
14. U. Lacnjevac, B.M. Jović , and V.D. Jović : Electrochim. Acta,2009, vol. 55, pp. 535-43.
15. L.F. Senna, S.L. Diaz, and L. Sathler: J. Appl. Electrochem., 2003, vol. 33, pp. 1155-61.
16. F.L. G. Silva, D.C.B. Lago, E.D. Elia, and L.F Sena: J. Appl. Electrochem., 2010, vol. 40, pp. 2013-22.
17. I.A. Carlos, E.D. Bidoia, E.M.J.A. Pallone, M.R.H. Almedia, and C.A.C. Souza: Surf. Coat. Tech., 2002, vol. 157, pp. 14-18.
18. I.A. Carlos, C.A.C. Souza, E.M.J.A. Pallone, R.H.P. Francisco, V. Cardoso, and B.S. Lima-Neto: J. Appl. Electrochem., 2000, vol. 30, pp. 987-94.
19. A. Survila, Z. Mockus, S. Kanapeckaie, V. Jasulaitiene, and R. Juskenas: Electrochim. Acta, 2007, vol. 52, pp. 3067-74.
20. K. Johannsen, D. Page, and S. Roy: Electrochim. Acta, 2000, vol. 45, pp. 3691-3702.
21. M.N. Nasonova, V.S. Galinker, V.A. Gorbatyuk, and L.L. Klimuk: Metall Met. Cer., 1976, vol. 15, pp. 83-85.
22. G.A. Finazzi, E.M. de Oliveira, and I.A. Carlos: Surf. Coat. Tech., 2004, vol. 187, pp. 377-87.
23. L. Skibina, J. Stevanovic, and A.R. Despic: J. Electroanal. Chem., 1991, vol. 310, pp. 391-401.
24. Y.A. Fedyushkina and A.V. Pomosov: Powder Metall. Met. Cer., 1971, vol. 10, pp. 434-36.
25. H.R. Myers and D.C. Montgomery: Response Surface Methodology: Process and Product Optimization Using Design Experiments, Wiley, New York, NY, 1995.
26. F.B.A. Ferreira, F.L.G. Silva, A.S. Luna, D.C.B. Lago, and L.F. Senna: J. Appl. Electrochem., 2007, vol. 37, pp. 473-81.
27. F.L.G. Silva, J.R. Garcia, V.G.M. Cruz, A.S Luna, D.C.B. Lago, and L.F. Sena: J. Appl. Electrochem., 2008, vol. 38, pp. 1763-69.
28. B. Kim and T. Ritzdorf: J. Electrochem. Soc., 2003, vol. 150, pp. 53-60.
29. G. Orhan and G Hapçi : Powder Tech., 2010, vol. 201, pp. 57-63.