메뉴 건너뛰기




Volumn , Issue , 2011, Pages 704-709

Compact configuration of a planar EBG based CM filter and crosstalk analysis

Author keywords

[No Author keywords available]

Indexed keywords

COMMON MODE; COMMON MODE SIGNAL; COMMON-MODE FILTERS; CROSS-TALK PROBLEM; CROSSTALK ANALYSIS; DIFFERENTIAL SIGNAL; ENERGY COUPLINGS; FREQUENCY AND TIME DOMAINS; POWER PLANES; REFERENCE PLANE; RESONANT MODE;

EID: 80054720166     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2011.6038400     Document Type: Conference Paper
Times cited : (9)

References (22)
  • 1
    • 4544321366 scopus 로고    scopus 로고
    • Power distribution networks for system-on-package: Status and challenges
    • May
    • M. Swaminathan, J. Kim, I. Novak, J. P. Libous, "Power distribution networks for system-on-package: Status and challenges," IEEE Trans. on Advanced Packaging, vol. 27, no. 2, pp. 286-300, May 2004.
    • (2004) IEEE Trans. on Advanced Packaging , vol.27 , Issue.2 , pp. 286-300
    • Swaminathan, M.1    Kim, J.2    Novak, I.3    Libous, J.P.4
  • 2
    • 1842474458 scopus 로고    scopus 로고
    • Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of high-speed digital PCB
    • Feb.
    • T. L. Wu, S. T. Chen, J. N. Huang, Y. H. Lin Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of high-speed digital PCB IEEE Trans. on EMC 46 1 33-45 Feb. 2004.
    • (2004) IEEE Trans. on EMC , vol.46 , Issue.1 , pp. 33-45
    • Wu, T.L.1    Chen, S.T.2    Huang, J.N.3    Lin, Y.H.4
  • 3
    • 77952743346 scopus 로고    scopus 로고
    • Novel electromagnetic bandgap array structure on power distribution network for suppressing simultaneous switching noise and minimizing effects on high-speed signals
    • May 2010
    • J. H. Kwon, D. U. Sim, S. I. Kwak, J. G. Yook, "Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High-Speed SignalsIEEE Trans. on EMC, vol. 52, no. 2, pp. 365-372, May 2010.
    • IEEE Trans. on EMC , vol.52 , Issue.2 , pp. 365-372
    • Kwon, J.H.1    Sim, D.U.2    Kwak, S.I.3    Yook, J.G.4
  • 5
    • 0038614784 scopus 로고    scopus 로고
    • Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits
    • Jun.
    • R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003.
    • (2003) IEEE Trans. Microw. Theory Tech. , vol.51 , Issue.6 , pp. 1629-1639
    • Abhari, R.1    Eleftheriades, G.V.2
  • 6
    • 27644498437 scopus 로고    scopus 로고
    • Design and modeling of high-impedance electromagnetic surfaces for switching noise suppression in power planes
    • DOI 10.1109/TEMC.2005.850692
    • T. Kamgaing and O. M. Ramahi, "Design and modeling of high impedance electromagnetic surfaces for switching noise suppression in power planesIEEE Trans. Electromagn. Compat., vol. 47, no. 3, pp. 479-489, Aug. 2005. (Pubitemid 41555168)
    • (2005) IEEE Transactions on Electromagnetic Compatibility , vol.47 , Issue.3 , pp. 479-489
    • Kamgaing, T.1    Ramahi, O.M.2
  • 7
    • 47649083558 scopus 로고    scopus 로고
    • Novel planar electromagnetic bandgap structures for wideband noise suppression and EMI reduction in high speed circuits
    • Aug.
    • J. Qin, O. M. Ramahi and V. Granatstein, "Novel planar electromagnetic bandgap structures for wideband noise suppression and EMI reduction in high speed circuits," IEEE Transaction on Electromagnetic Compatibility, Vol. 49, No. 3, pp. 661-669, Aug. 2007.
    • (2007) IEEE Transaction on Electromagnetic Compatibility , vol.49 , Issue.3 , pp. 661-669
    • Qin, J.1    Ramahi, O.M.2    Granatstein, V.3
  • 8
    • 15844369076 scopus 로고    scopus 로고
    • A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits
    • DOI 10.1109/LMWC.2005.844216
    • T.L. Wu, C.C. Wang, Y.H. Lin, T.K. Wang, G. Chang, "A Novel Power Plane With Super-Wideband Elimination of Ground Bounce Noise on High Speed Circuits", IEEE Microwave and Wireless Components Letters, vol. 15, no. 3, pp. 174-176, March 2005. (Pubitemid 40421606)
    • (2005) IEEE Microwave and Wireless Components Letters , vol.15 , Issue.3 , pp. 174-176
    • Wu, T.-L.1    Wang, C.-C.2    Lin, Y.-H.3    Wang, T.-K.4    Chang, G.5
  • 9
    • 10644270919 scopus 로고    scopus 로고
    • Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures
    • Nov.
    • S. Shahparnia, O.M. Ramahi, "Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures" IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 580-587, Nov. 2004.
    • (2004) IEEE Trans. Electromagn. Compat. , vol.46 , Issue.4 , pp. 580-587
    • Shahparnia, S.1    Ramahi, O.M.2
  • 10
    • 27644498437 scopus 로고    scopus 로고
    • Design and modeling of high-impedance electromagnetic surfaces for switching noise suppression in power planes
    • DOI 10.1109/TEMC.2005.850692
    • T. Kamgaing and O. M. Ramahi, "Design and modeling of high impedance electromagnetic surfaces for switching noise suppression in power planesIEEE Trans. Electromagn. Compat., vol. 47, no. 3, pp. 479-489, Aug. 2005. (Pubitemid 41555168)
    • (2005) IEEE Transactions on Electromagnetic Compatibility , vol.47 , Issue.3 , pp. 479-489
    • Kamgaing, T.1    Ramahi, O.M.2
  • 11
    • 27744554204 scopus 로고    scopus 로고
    • Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in highspeed circuits
    • Sept.
    • T.L. Wu, Y.H. Lin, T.K. Wang, C.C. Wang, S.T. Chen, "Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in highspeed circuits", IEEE Trans. on Microwave Theory and Techniques, vol. 53, no. 9, pp. 2935-2942, Sept. 2005.
    • (2005) IEEE Trans. on Microwave Theory and Techniques , vol.53 , Issue.9 , pp. 2935-2942
    • Wu, T.L.1    Lin, Y.H.2    Wang, T.K.3    Wang, C.C.4    Chen, S.T.5
  • 12
    • 70449420066 scopus 로고    scopus 로고
    • Fundamental Mechanisms of Coupling between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I-Microstrip lines", in
    • Athens, Greece, June 11-12, 2009
    • F. de Paulis, A. Orlandi, L. Raimondo, G.Antonini, "Fundamental Mechanisms of Coupling Between Planar Electromagnetic Bandgap Structures and Interconnects in High-Speed Digital Circuits. Part I-Microstrip lines", in Proc. of EMC Europe Workshop 2009, Athens, Greece, June 11-12, 2009.
    • (2009) Proc. of EMC Europe Workshop
    • De Paulis, F.1    Orlandi, A.2    Raimondo, L.3    Antonini, G.4
  • 13
    • 70249084467 scopus 로고    scopus 로고
    • Signal integrity analysis of single-ended and differential striplines in presence of EBG planar structures
    • September
    • F. De Paulis, A. Orlandi Signal Integrity Analysis of Single-Ended and Differential Striplines in Presence of EBG Planar Structures IEEE Microwave and Wireless Components Letters 19 nr. 9 September 2009 554-556.
    • (2009) IEEE Microwave and Wireless Components Letters , vol.19 , Issue.9 , pp. 554-556
    • De Paulis, F.1    Orlandi, A.2
  • 16
    • 36348963726 scopus 로고    scopus 로고
    • Suppression of EMI and electromagnetic noise in packages using embedded capacitance and miniaturized electromagnetic bandgap structures with high-k dielectrics
    • DOI 10.1109/TADVP.2007.908028
    • B. Mohajer-Iravani and O. M. Ramahi, "Suppression of EMI and electromagnetic noise in packages using embedded capacitance and miniaturized electromagnetic bandgap structures with high-k dielectrics" IEEE Transactions on Advanced Packaging, vol. 30, no. 4, pp. 776-788, Nov. 2007. (Pubitemid 350148404)
    • (2007) IEEE Transactions on Advanced Packaging , vol.30 , Issue.4 , pp. 776-788
    • Mohajer-Iravani, B.1    Ramahi, O.M.2
  • 20
    • 80054722000 scopus 로고    scopus 로고
    • Computer Simulation Technology
    • Computer Simulation Technology, CST Studio 2010, www.cst.com, 2010.
    • (2010) , pp. 2010
  • 22
    • 80054722628 scopus 로고    scopus 로고
    • Link Path Analyzer; December
    • MS&T EMC Laboratory, Link Path Analyzer; http://emclab.mst.edu/index. html, December 2010.
    • (2010)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.