Invited paper: Sintering mechanism of vapor self-assembled multilayer (VSAM) coated Cu nano particles for application in Cu nano ink

Electronic Materials Letters

Volumn 7, Issue 3, 2011, Pages 195-199

  Haque, Md Mominul ^a   Park, ShinYoung ^a   Her, Jaehak ^a   Park, Joong hak ^b   Lee, Caroline Sunyong ^a  

^a Hanyang University   (South Korea)

^b Nano Technology Inc   (South Korea)

Author keywords

Cu nanoparticle; octanethiol; octanol; prevent oxidation; VSAM

Indexed keywords

CU NANOPARTICLES; OCTANETHIOL; OCTANOL; PREVENT OXIDATION; VSAM;

COPPER; INK; NANOPARTICLES; OXIDATION; SINTERING; SUBSTRATES; SURFACE ACTIVE AGENTS; VAPORS;

INK JET PRINTING;

COPPER; DISPERSIONS; OCTANOLS; OXIDATION; RESISTIVITY; SINTERING; SUBSTRATES; SURFACTANTS; VAPORS; VISCOSITY;

EID: 80054100034     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-011-0903-3     Document Type: Article

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