Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces

Applied Physics Letters

Volumn 99, Issue 13, 2011, Pages

  Vijayashankar, Dandapani ^a   Zhu, Hong ^b   Garg, Saurabh ^a   Teki, Ranganath ^a   Ramprasad, R ^b   Lane, Michael W ^c   Ramanath, Ganpati ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b UNIVERSITY OF CONNECTICUT   (United States)

^c EMORY AND HENRY COLLEGE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMISTIC MECHANISM; BOND SCISSIONS; DENSITY FUNCTIONAL THEORY CALCULATIONS; FRACTURE TEST; METAL-DIELECTRIC INTERFACE; MOISTURE-INDUCED DELAMINATION; NANO DEVICE; WORK OF ADHESION;

ADHESION; COPPER; DELAMINATION; DENSITY FUNCTIONAL THEORY; ELECTRON SPECTROSCOPY; FRACTURE TESTING; FRACTURE TOUGHNESS; MECHANICAL PROPERTIES; MOISTURE; SILICA; SOLID STATE PHYSICS; STEEL SHEET;

FRACTURE;

EID: 80053499557     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3622304     Document Type: Article

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