Effects of grain size and temperature on mechanical and failure properties of ultrananocrystalline diamond

Diamond and Related Materials

Volumn 20, Issue 10, 2011, Pages 1303-1309

  Sha, Z D ^a   Branicio, P S ^a   Sorkin, V ^a   Pei, Q X ^a   Zhang, Y W ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

Fracture mechanisms; Fracture strength; Grain size effects; Mechanical properties; Ultrananocrystalline diamond

Indexed keywords

AMORPHOUS-LIKE; DESIGN AND OPTIMIZATION; ELASTIC SOFTENING; FAILURE BEHAVIORS; FAILURE MECHANISM; FAILURE PROPERTIES; FRACTURE MECHANISMS; FRACTURE STRENGTHS; GRAIN SIZE; GRAIN SIZE EFFECTS; GRAIN SLIDING; INTERGRANULAR FRACTURE; MOLECULAR DYNAMICS SIMULATIONS; NORMAL STRESS; RANDOM DISTRIBUTION; ROOM TEMPERATURE; TENSILE LOADING; TRIPLE JUNCTION; ULTRA-NANOCRYSTALLINE DIAMOND; ULTRANANOCRYSTALLINE DIAMONDS; YOUNG'S MODULUS;

DIAMONDS; GRAIN BOUNDARY SLIDING; GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; MECHANISMS; MOLECULAR DYNAMICS; TENSILE STRENGTH;

FRACTURE;

EID: 80053356363     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2011.08.012     Document Type: Article

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