Residual stress analysis in thin device wafer using piezoresistive stress sensor

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 6, 2011, Pages 841-851

  Kumar, Aditya ^a   Zhang, Xiaowu ^a   Zhang, Qing Xin ^a   Jong, Ming Chinq ^a   Huang, Guanbo ^b   Vincent, Lee Wen Sheng ^a   Kripesh, Vaidyanathan ^a   Lee, Charles ^a   Lau, John H ^a   Kwong, Dim Lee ^a   Sundaram, Venky ^c   Tummula, Rao R ^c   Meyer Berg, Georg ^d  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^d INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Piezoresistive sensor; residual stress; tape mounting; wafer back grinding; wafer bow

Indexed keywords

DEVICE WAFERS; DICING TAPES; FINE GRINDING; PIEZORESISTIVE COEFFICIENTS; PIEZORESISTIVE SENSORS; PIEZORESISTIVE STRESS SENSORS; STRESS SENSOR; THINNING PROCESS; WAFER BACK-GRINDING; WAFER BOW; WAFER THICKNESS;

CHEMICAL MECHANICAL POLISHING; GRINDING (MACHINING); SENSORS; STRESS ANALYSIS; STRESS MEASUREMENT; TAPES;

RESIDUAL STRESSES;

EID: 80053352930     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2135353     Document Type: Article

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