Adhesion performance and thermo-mechanical property of epoxy-based underfill

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 70-76

  Luo, Shijian ^a   Yamashita, T ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesives; Cobalt; Computer aided analysis; Curing; EPON; Epoxy resins; Glass; Temperature; Thermal expansion; Thermomechanical processes

Indexed keywords

ADHESION; ADHESIVES; CATALYSTS; COATINGS; COBALT; COMPUTER AIDED ANALYSIS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GLASS; GLASS TRANSITION; JOINING; MANUFACTURE; MECHANICAL PROPERTIES; PHENOLS; SILICON NITRIDE; SILICON OXIDES; TEMPERATURE; THERMAL EXPANSION;

COBALT ACETYLACETONATE; COEFFICIENTS OF THERMAL EXPANSIONS; CYCLOALIPHATIC STRUCTURE; DIFFERENTIAL SCANNING CALORIMETERS; EPON; THERMOMECHANICAL ANALYZERS; THERMOMECHANICAL PROCESS; THERMOMECHANICAL PROPERTIES;

EPOXY RESINS;

EID: 80052871795     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860576     Document Type: Conference Paper

References (7)

1. D. Suryanarayana, R. Hsiao, T. P. Gall, and J. M. McCreary, "Flip-Chip Solder Bump Fatigue Enhancement by Polymer Encapsulation," IEEE Transaction of Components & Hybrid and Manufacturing Technology, Vol. 16, No. 8, p.858, 1993.
2. J. C. W. van Vroonhoven, "Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits," Journal of Electronic Packaging, Vol. 115, p.28-32, 1993.
3. C. K. Gurumurthy, J. Jiao, L. G. Norris, C. Y. Hui, and E. J. Kramer, "A new Approach For Thermal Fatigue Testing of the Underfill/Passivation Interface", AMD-Vol. 222/EEP-Vol. 20, Application of Fracture Mechanics in Electronic Packaging, ASME, pp41-48, 1997
4. th IEEE Electronic Components and Technology Conference, p. 524, 1996.
5. th Electronic Components and Technology Conference, p132, 1998
6. Charan K. Gurumurthy, Larry G. Norris, Chung-Yuen Hui, Edward J, Kramer, "Characterization of Underfill/Passivation Interfacial Adhesion for Direct Chip Attach Assemblies Using Fracture Toughness and Hydro-Thermal Fatigue Measurements", Proceeding of 48th Electronic Components and Technology Conference, p721, 1998
7. M. B. Vincent, Laura Meyers and C. P. Wong, "Enhancement of Underfill Adhesion to Die and Substrate by Use of Silane Additives", 1998 Proceedings of International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces, Braselton, GA, p49, 1998.