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Volumn 650, Issue 1, 2011, Pages 150-157
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3D-FBK pixel sensors: Recent beam tests results with irradiated devices
r a a a b b b b b b b c c c c d d d d d more..
d
CERN
(Switzerland)
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Author keywords
3D sensors; ATLAS upgrade; HL LHC; Radiation detectors; Silicon sensors
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Indexed keywords
3D SENSOR;
3D SILICON SENSORS;
ATLAS EXPERIMENT;
ATLAS PIXEL;
ATLAS UPGRADE;
BEAM TESTS;
COLLIDER;
HL-LHC;
IRRADIATED DEVICES;
LARGE HADRON COLLIDER;
PIXEL DETECTOR;
PIXEL SENSORS;
PROCESSING FACILITIES;
READOUT CHIPS;
SECONDARY VERTICES;
SILICON PIXEL SENSORS;
SILICON SUBSTRATES;
SILICON TECHNOLOGIES;
THREE-LAYER;
TRACKING DEVICES;
VERY-LARGE-SCALE INTEGRATION;
WAFER SURFACE;
COLLIDING BEAM ACCELERATORS;
ELECTRODES;
HIGH ENERGY PHYSICS;
INNOVATION;
PIXELS;
RADIATION DETECTORS;
READOUT SYSTEMS;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON DETECTORS;
SILICON SENSORS;
SILICON WAFERS;
THREE DIMENSIONAL;
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EID: 80052262862
PISSN: 01689002
EISSN: None
Source Type: Journal
DOI: 10.1016/j.nima.2010.12.209 Document Type: Conference Paper |
Times cited : (11)
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References (28)
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