Micromechanics-based thermoelastic model for functionally graded particulate materials with particle interactions

Journal of the Mechanics and Physics of Solids

Volumn 55, Issue 1, 2007, Pages 132-160

  Yin, H M ^a   Paulino, G H ^a   Buttlar, W G ^a   Sun, L Z ^b  

^a University of Illinois at Urbana Champaign   (United States)

^b University of California at Irvine   (United States)

Author keywords

Constitutive behavior; Functionally graded materials; Microstructures; Particulate reinforced material; Thermal stress

Indexed keywords

COMPOSITE MICROMECHANICS; HEAT CONDUCTION; MICROSTRUCTURE; THERMAL EXPANSION; THERMAL STRESS; THERMOELASTICITY;

CONSTITUTIVE BEHAVIOR; PARTICULATE REINFORCED MATERIALS; STEADY STATE;

FUNCTIONALLY GRADED MATERIALS;

EID: 34548043676     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2006.05.002     Document Type: Article

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