Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI

Journal of Micromechanics and Microengineering

Volumn 21, Issue 8, 2011, Pages

  Makihata, M ^a   Tanaka, S ^a   Muroyama, M ^a   Matsuzaki, S ^b   Yamada, H ^b   Nakayama, T ^b   Yamaguchi, U ^b   Mima, K ^b   Nonomura, Y ^c   Fujiyoshi, M ^c   Esashi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b TOYOTA MOTOR CORPORATION   (Japan)

^c Rd Management Section   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE WAFER BONDING; BENZOCYCLOBUTENE; GLASS MOLDS; GLASS SUBSTRATES; METAL ELECTRODES; MICRO ELECTRO MECHANICAL SYSTEM; POLYMERIZATION DEGREE; WAFER BONDING PROCESS; WAFER-LEVEL INTEGRATION;

BUTENES; ELECTRODES; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS; GLASS BONDING; INTEGRATION; MOLDING; MOLDS; POLYMERIZATION; POLYMERS; SUBSTRATES;

WAFER BONDING;

EID: 80051500535     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/8/085002     Document Type: Article

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