Characterization of a liquid-metal microdroplet thermal interface material

Experimental Thermal and Fluid Science

Volumn 35, Issue 7, 2011, Pages 1250-1254

  Hamdan, A ^a   McLanahan, A ^a   Richards, R ^a   Richards, C ^a  

^a Washington State University   (United States)

Author keywords

Contact resistance; Thermal interface material; Thermal interface resistance

Indexed keywords

A-THERMAL; APPLIED LOADS; EXPERIMENTAL FACILITIES; MICRO DROPLETS; MODEL DATA; SILICON DIE; STEADY-STATE CONDITION; THERMAL INTERFACE MATERIAL; THERMAL INTERFACE MATERIALS; THERMAL INTERFACES;

CONTACT RESISTANCE; DIES; FATIGUE OF MATERIALS; LIQUIDS; MERCURY (METAL); THERMAL INSULATING MATERIALS;

INTERFACES (MATERIALS);

EID: 79960973984     PISSN: 08941777     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.expthermflusci.2011.04.012     Document Type: Article

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