A facility for characterizing the steady-state and dynamic thermal performance of microelectromechanical system thermal switches

Review of Scientific Instruments

Volumn 79, Issue 3, 2008, Pages

  Cho, J H ^a   Richards, C D ^b   Richards, R F ^b  

^a Johns Hopkins University   (United States)

^b Washington State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC SWITCHES; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; SENSORS; THIN FILMS;

THERMAL PERFORMANCE; THERMAL SWITCHES;

MEMS;

EID: 41549094537     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2894147     Document Type: Article

References (21)

1. J. Khandurina, T. E. McKnight, S. C. Jacobson, L. C. Waters, R. S. Foote, and J. M. Ramsey, Anal. Chem. 72, 2995 (2000).
2. B. C. Giordano, J. Ferrance, S. Swedberg, A. F. R. Huhmer, and J. P. Landers, Anal. Biochem. 291, 124 (2001).
3. K. Shen, X. Chena, M. Guob, and J. Chenga, Sens. Actuators B 105, 251 (2005).
4. D. S. Yoon, Y.-S. Lee, Y. Lee, H. J. Cho, S. W. Sung, K. WOh, J. Cha, and G. Lim, J. Micromech. Microeng. 12, 813 (2002).
5. D. J. Sadler, R. Changrani, P. Roberts, C.-F. Chou, and F. Zenhausern, IEEE Trans. Compon. Packag. Technol. 26, 309 (2003).
6. S. Poser, T. Schulz, U. Dillner, V. Baier, and J. M. Köhler, Eurosensors X, Leuven, Belgium, 8-11 September 1996 (unpublished), p. 1197.
7. C. Y. Lee, G. B. Lee, H. H. Liu, and F. C. Hwang, Int. J. Nonlinear Sci. Numer. Simul. 3, 215 (2002).
8. Z. Zhan, C. Dafu, Y. Zhongyao, and W. Li, 1st Annual International Conference on Microtechnologies in Medicine and Biology, 2000 (unpublished), p. 25.
9. W.-C. Tian, H. K. L. Chan, C.-J. Lu, S. W. Pang, and T. Zellers, J. Microelectromech. Syst. 14, 498 (2005).
10. A. Miner, A. Majumdar, and U. Ghoshal, Appl. Phys. Lett. 75, 1176 (1999).
11. G. J. Snyder, J.-P. Fleurial, T. Caillat, R. Yang, and G. Chen, J. Appl. Phys. 92, 1564 (2002).
12. R. McCarty, K. P. Hallinan, B. Sanders, and T. Somphone, J. Heat Transfer 129, 749 (2007).
13. R. McCarty, D. Monaghan, K. P. Hallinan, and B. Sanders, J. Thermophys. Heat Transfer 21, 505 (2007).
14. L. W. Weiss, J. H. Cho, K. E. McNeil, C. D. Richards, D. F. Bahr, and R. F. Richards, J. Micromech. Microeng. 16, S262 (2006).
15. F. L. Walls, IEEE Trans. Instrum. Meas. 1M-36, 596 (1987).
16. A. D. Laws, Y. J. Chang, V. M. Bright, and Y. C. Lee, Proceedings of IMECE2006, IMECE2006-14540, 2006 (unpublished).
17. B. Marland, D. Bugby, and C. Stouffer, Proceedings of Conference on Space Technology and Applications International Forum, 2000 (unpublished), Vol. 504, p. 837.
18. M. A. Beasley, S. L. Firebaugh, R. L. Edwards, A. C. Keeney, and R. Osiander, Space Technology and Applications International Forum (STAIF), 2004 (unpublished), p. 119.
19. J. Cho, T. Wiser, C. Richards, D. Bahr, and R. Richards, Sens. Actuators, A 133, 55 (2007).
20. J. Gong, G. Cha, Y. S. Ju, and C. J. Kim, IEEE MEMS, Tucson, AZ, 2008 (unpublished).
21. L. Latorre, J. Kim, J. Lee, P. de Guzman, H. J. Lee, P. Nouet, and C. J. Kim, J. Microelectromech. Syst. 11, 302 (2002).