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Volumn 158, Issue 9, 2011, Pages

Surface-activation process for electroless deposition of adhesive metal (Ni-B, Cu) films on Si substrates using catalytic nanoanchors

(5) Yae, Shinji a Sakabe, Keisuke a Fukumuro, Naoki a Sakamoto, Susumu a,b Matsuda, Hitoshi a

a UNIVERSITY OF HYOGO (Japan)

b Nippon Oikos CoLtd (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE METALS; AUTOCATALYTIC; CATALYZATION; CONVENTIONAL METHODS; COPPER FILM DEPOSITION; ELECTROLESS DISPLACEMENT; ELECTROLESS METAL DEPOSITION; HYDROFLUORIC ACID ETCHING; METAL FILLING; METAL FILM; METAL NANOPARTICLES; METAL NANORODS; NANOPORE FORMATION; NON-METALLIC SUBSTRATES; PRE-TREATMENT; SI SUBSTRATES; SI SURFACES; SILICON SUBSTRATES;

BORON; BORON COMPOUNDS; COPPER; DEPOSITION; HYDROFLUORIC ACID; METALLIC FILMS; NANOPORES; NANORODS; SILICON; SUBSTRATES;

METALS;

EID: 79960923334 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3610221 Document Type: Article

Times cited : (30)

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