Higher fatigue cracking resistance of twin boundaries than grain boundaries in Cu bicrystals

Scripta Materialia

Volumn 65, Issue 6, 2011, Pages 505-508

  Li, L L ^a   Zhang, Z J ^a   Zhang, P ^a   Zhang, Z F ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Bicrystal; Fatigue cracking; Grain boundary; Persistent slip bands; Twin boundary

Indexed keywords

COHERENT TWIN; FATIGUE CRACKING; FATIGUE CRACKING MECHANISM; FATIGUE CRACKING RESISTANCE; HIGH ENERGY; INTERGRANULAR; LOADING DIRECTION; PERSISTENT SLIP BANDS; TWIN BOUNDARIES; TWIN BOUNDARY;

GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE;

BICRYSTALS;

EID: 79960845063     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.06.009     Document Type: Article

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