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Volumn 293, Issue 1-2, 2000, Pages 7-14
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The study of fatigue in polycrystalline copper under various strain amplitude at stage I: Crack initiation and propagation
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Author keywords
Crack initiation; Crack propagation; Dislocation; Fatigue
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Indexed keywords
COPPER;
CRACK INITIATION;
CRACK PROPAGATION;
DISLOCATIONS (CRYSTALS);
FAILURE (MECHANICAL);
FATIGUE TESTING;
GRAIN BOUNDARIES;
OPTICAL MICROSCOPY;
SCANNING ELECTRON MICROSCOPY;
STRAIN;
TRANSMISSION ELECTRON MICROSCOPY;
FATIGUE FAILURES;
PERSISTENT SLIP BOARD (PSB);
PLASTIC STRAIN;
POLYCRYSTALLINE MATERIALS;
COPPER;
CRACK INITIATION;
CRACK PROPAGATION;
FATIGUE ANALYSIS;
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EID: 0034333466
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/S0921-5093(00)01246-6 Document Type: Article |
Times cited : (36)
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References (28)
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