Microstructure evolution of gold thin films under spherical indentation for micro switch contact applications

Journal of Materials Science

Volumn 46, Issue 18, 2011, Pages 6111-6117

  Arrazat, Brice ^a,b   Mandrillon, Vincent ^a,b   Inal, Karim ^a   Vincent, Maxime ^b,c   Poulain, Christophe ^b  

^a Center Microelectronics De Provence Georges Charpak   (France)

^b CEA LETI   (France)

^c Schneider Electric Industries   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT AREAS; CYCLIC LOADINGS; ELECTRON BACK SCATTER DIFFRACTION; FAILURE MECHANISM; FIBER TEXTURE; GOLD THIN FILMS; GRAIN ROTATION; HIGH RESOLUTION; METAL MICROSTRUCTURE; MICRO ELECTRO MECHANICAL SYSTEM; MICROSTRUCTURE EVOLUTIONS; MICROSWITCHES; RADIO FREQUENCIES; RF-MEMS; SPHERICAL DIAMOND; SPHERICAL INDENTATIONS; STATIC LOADING; SWITCHING MODES; TIP RADIUS;

CYCLIC LOADS; GRAIN GROWTH; LOADING; MEMS; MICROSTRUCTURE; PLASTIC DEFORMATION; ROTATION; SPHERES; STRAIN HARDENING; THIN FILMS;

GOLD;

EID: 79960841376     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-011-5575-8     Document Type: Article

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