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Volumn 1, Issue , 2003, Pages 151-154
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Silicon electroosmotic micropumps for integrated circuit thermal management
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Author keywords
Application specific integrated circuits; Cooling; Geometry; Integrated circuit packaging; Micropumps; Prototypes; Pumps; Silicon; Surface treatment; Thermal management
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Indexed keywords
ACTUATORS;
APPLICATION SPECIFIC INTEGRATED CIRCUITS;
COOLING;
ELECTROOSMOSIS;
GEOMETRY;
INTEGRATED CIRCUITS;
MICROSYSTEMS;
PUMPS;
SILICON;
SURFACE TREATMENT;
TEMPERATURE CONTROL;
THERMAL VARIABLES CONTROL;
TRANSDUCERS;
FORCED CONVECTIVE COOLING;
INHERENT RELIABILITIES;
INTEGRATED CIRCUIT PACKAGING;
MICRO PUMP;
PROTOTYPES;
SILICON SUBSTRATES;
STRUCTURAL ELEMENTS;
THERMAL MANAGEMENT APPLICATIONS;
SOLID-STATE SENSORS;
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EID: 79960651376
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SENSOR.2003.1215275 Document Type: Conference Paper |
Times cited : (30)
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References (8)
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