Parametric optimization of multichanneled heat sinks for VLSI chip cooling

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 1, 2001, Pages 2-9

  Murakami, Yoichi ^a   Mikić, Bora B ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Cooling; Forced convection; Heat sink; Microchannel; Multichannel; Optimization; VLSI

Indexed keywords

COOLING; FORCED CONVECTION; MICROPROCESSOR CHIPS; OPTIMIZATION; PRESSURE DROP; VLSI CIRCUITS;

MULTICHANNLED HEAT SINKS;

HEAT SINKS;

EID: 0035278824     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.910795     Document Type: Article

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